The ZL50111 is a highly functional TDM to Packet bridging device that provides structured and unstructured circuit emulation services (CES) for T1/E1 streams across a packet network based on Ethernet technology. The ZL50111 is capable of assembling user-defined packets of TDM traffic from the TDM access interface and transmitting them from the Ethernet interfaces using a variety of protocols such as Ethernet VLAN's, IP (both versions 4 and 6) and MPLS. The device also supports four different classes of service on packet egress, allowing priority treatment of TDM-based traffic. The circuit emulation features in the ZL50111 comply with the relevant standards currently being developed within the IETF's PWE3 working group. The ZL50111 incorporates a range of powerful clock recovery mechanisms and sufficient on-chip memory that external memory is not required in most applications. This reduces system costs and simplifies the design.

Features & Benefits

• 1024 bi-directional 64 kbps channels in structured, synchronous CES
• 32 T1/E1 or 2 T3/E3 unstructured, asynchronous CES, with integral per stream clock recovery
• Interface either directly to LIU, via a framer, or via a TDM backplane
• Dual reference Stratum 3, 4 and 4E PLL for synchronous operation
• 3 x 100 Mbps MII or Dual Redundant 1000 Mbps GMII/PCS(TBI) Ethernet Interfaces
• Flexible 32 bit host CPU interface (Motorola PowerQUICC^TM II compatible)
• On-chip packet memory for self-contained operation, with buffer depths of over 16 ms
• Flexible, multi-protocol packet encapsulation
• Packet sequencing to allow lost packet detection
• Four classes of service with programmable priority mechanisms (WFQ and SP)
• Classification of incoming packets at layers 2, 3, 4, and 5

Documentation

• zl50110-1-2-4-datasheet-oct09.pdf

Design Manuals

• zl5011x_design_manual_apr10.pdfPlease login to access protected documents.
• zl50110-1-4-secure-memory-estimator-apr2005.xlsPlease login to access protected documents.
• zl5011x-ethernet-bandwidth-estimator-aug2005.xls

Software Manuals

• zl50110-1-4-full-programmers-model-jan2005.pdfPlease login to access protected documents.
• zls50111-full-api-userguide-nov2008.pdfPlease login to access protected documents.

Application Notes

• List of ZL5011x Application Notes - May 2009Please login to access protected documents.
• ZLAN-156 (secure) - Applications of the CESoP ProcessorsPlease login to access protected documents.
• ZLAN-138 (secure) - Applications of the CESoP ProcessorsPlease login to access protected documents.
• ZLAN-139 (secure) - MT9076 Framer with ZL5011xPlease login to access protected documents.

Product Previews

• zl50110-1-2-4-product-preview-dec2007.pdf

Downloads, Firmware and Drivers

BSDL Files:
• zl50111gag.bsd

IBIS Models:
• zl50111gag.ibs

PCB Design Files:
• zle50110-1-4-pcb-design-files.zip

Evaluation Boards

• zl50110-1-4-v4-secure-orcad-libary-dec2004.olb
• zls50110-1-4-demostration-software-user-guide-sep2003.pdf
• zle50111-eval-board-description-nov2004.pdf
• zle50110-1-eval-board-user-guide-sep2003.pdf

Reference Designs

• zl50110-1-full-reference-schematic-sep2003.pdfPlease login to access protected documents.

Typical Applications

• Leased Line support over packet network
• Multi-Tenant Unit access concentration
• Packet switched backplane applications
• TDM backplane extension / expansion

Related Functions

• zl50110-1-full-reference-schematic-sep2003.pdf

Product Packaging & Availability

Part Number	Package Type	Pin Count	Lead-Free Option	Shipping Option(s)	Lead Time(wks)	Status
ZL50111GAG	PBGA	552		Trays. Bake & Drypack	6-8 weeks	Production
ZL50111GAG2	PBGA	552	Pb-free-Tin/Silver/Copper	Trays. Bake & Drypack	10-12 weeks	Production

Packaging Information

• Soldering Profiles
• Moisture Sensitivity
• Shelf Life
• Reliability Data

Technical Support

Registered users click here to access the service.

Not registered? Register online today and get access to all our technical support services.

Forgot your password?

Visit the Contact Sales page to find distributor, representative and Zarlink sales office contact information.